Before washing, look front and back.

After the peelable adhesive is torn off.

Irradiated by a strong light (full-spectrum halogen lamp) in a clean room, you can clearly see a circle of residue along the outer edge of the peelable adhesive.

Under the microscope, a gelatinous residue can be seen.

Clean with AHLR03 cleaning agent for 120 seconds at 65°C, 40KHz, 50W/L ultrasonic wave.
It was found that most of the residual glue had been removed. However, under enhanced exposure, the residue is still clearly visible. (front/glass side)

Use SynGC04 to synthesize glue remover, and clean it for 120 seconds at 65°C, 40KHz, 50W/L ultrasonic wave.
Also under enhanced exposure, the residue can be clearly seen.

Change to dust cleaning agent PTC17plus, the agent concentration is 10%, and clean for 120 seconds at 65°C, 40KHz, 50W/L ultrasonic wave. Irradiated with a strong light (full-spectrum halogen lamp) in the clean room, and found that the residue along the outer edge of the peelable adhesive has been washed.

Observe with a microscope:
The front (glass side) was found to be completely washed.

Before washing, the lens frame is coated with hardened GT-7 due to particles attached to the surface. Put it under the tap and rinse it with pure water. It is found that the dust on the surface cannot be washed away.

Put in 5% PTC04, 40KHz ultrasonic wave, 30W/L, shake and clean for 3 minutes. It was found that some of the dirt had been washed, but the particles could not be completely removed.

Take another lens, and before cleaning, the surface is still attached with particles.

Change to 5% SGC06A, 40KHz ultrasonic wave, 30W/L, and shake for 3 minutes. It is found that most of the dirt has been washed, but the particles cannot be completely removed.

After extending the ultrasonic cleaning time to 6 minutes and 9 minutes, it was found that although the residual particles became lighter, they still could not be removed.

Extend the soaking time over night. After cleaning, it was found that although the particle had been washed off, the coating of the lens had been damaged.

Take another lens, and attach the particle to the surface as well.

Change to 100% ACHM04-A, 40KHz ultrasonic wave, 30W/L, and shake for 3 minutes. It is found that the particle has been washed clean, but even the GT-7 hardened ink on the frame has been washed off. So far, it has been quite confirmed that the attached particles are likely to be resin residues.

Develop new formula A. Combine particle cleaner and hardened ink remover. However, the ink wetting ability must be reduced to avoid damage to the GT-7 frame ink. Another piece of lens will be taken, with the same particle attached to the surface.

Put in the new formula A, 40KHz ultrasonic wave, 30W/L, and shake for 3 minutes. It is found that most of the dirt has been washed, but the particles cannot be completely removed. Even if it is extended to 6 minutes or 9 minutes, it cannot be removed.

Wipe it with a dust-free cloth covered with nickel, and find that the particle is very soft, and it sticks to the lens after wiping. Judging from this, the possibility that this particle may be resin is extremely high.

Based on this, a new formula particle cleaner PTC17plus was developed. Take another lens, and attach the particle to the surface as well.

Put the new formula PTC17plus, 40KHz ultrasonic wave, 30W/L, and shake for 3 minutes. Found that the particle has been completely cleared.

Repeat the test. Take another lens, and attach the particle to the surface as well.

Put it in the new formula dust cleaning agent PTC17plus, 40KHz ultrasonic wave, 30W/L, and shake for 3 minutes. Found that the particle has been completely cleared.

Suggestions and discussions:

Before washing, look front and back.

Observe with a microscope at 50 times magnification:

Take a piece of IC wafer, put it in PTC17plus (100% stock solution) at room temperature (28°C), and clean it with 40Khz, 100W/L ultrasonic wave for 60 seconds. Take it out and rinse it with water. It was found that the black marks on the surface had been removed.

Repeat the test. Take another IC wafer, put it in the dust cleaning agent PTC17plus at room temperature (28°C), and clean it with 40Khz, 100W/L ultrasonic wave for 60 seconds. Take it out and rinse it with water. It was found that the black marks on the surface had been removed.

Repeat the test. Take another IC wafer, put it in the dust cleaning agent PTC17plus at room temperature (28°C), and clean it with 40Khz, 100W/L ultrasonic wave for 60 seconds. Take it out and rinse it with water. It was found that the black marks on the surface had been removed.

Suggestions and discussions:

Before washing, look front and back.

Observe with a microscope at 100 times magnification: it is found that the surface is covered with carbon black, dust and dirt.

Take a piece of copper, put it in the micro dust cleaning agent PTC17plus (100% stock solution) at room temperature (25°C), and clean it with 40Khz, 100W/L ultrasonic wave for 180 seconds. Take out the flush water, rinse and remove the patticle. Then soak in the copper oxide reducing agent COR01D for about 1 minute to reduce copper oxide. Observe with a microscope at 100 times magnification: It is found that the carbon black and dust on the surface have been removed. However, it was observed that part of the adhesive film that fixed the copper sheet for laser cutting remained on the copper probe.

Repeat the test. Take another piece of copper, put it in the dust cleaning agent PTC17plus (100% stock solution) at room temperature (25°C), and clean it with 40Khz, 100W/L ultrasonic wave for 180 seconds. Take out the flush water, rinse and remove the patticle. Then soak in silicon dioxide film cleaning agent SMC04 for about 1 minute to remove copper oxide. Observe with a microscope at 100 times magnification: It is found that the carbon black and dust on the surface have been removed. Film residue was also not observed.

Suggestions and discussions:

Before washing, look front and back.

Observe with a microscope at 50 times magnification:

Observe with a microscope at 800 times magnification, but it is not clear:

Take a piece of IC wafer, put it in PTC17plus micro dust cleaning agent at room temperature (28°C), and clean it with 40Khz, 100W/L ultrasonic wave for 60 seconds. Take it out and rinse it with water. It was found that the black marks on the surface had been removed.

Suggestions and discussions: