The customer's description of the workpiece: The IC chip is covered with silver and black hardening ink, and the ink is a wafer. There are exposed gold fingers on the other side of the IC chip, and the black part on the same side as the gold fingers is solder resist ink. The purpose of this cleaning test is to remove silver and black hardened ink, but the black solder resist ink on the same side as the gold finger cannot be damaged.
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Before washing, look. The surface of the IC chip is covered with silver hardening ink, and the black part on the same side as the gold finger is solder resist ink.
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Place the IC wafer at 80°C in hardened ink cleaners ACHM04-A, ACHM04-H1 and PTC13 for 10 minutes.
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Take it out and rinse with water. After cleaning, it was found that none of the three agents could effectively remove the silver ink. Among them, although PTC13 can remove the ink, but PTC13 is an alkaline ink cleaning agent. Once the ink is removed, PTC13 will corrode the exposed wafer and cause damage to the chip.
The pictures above are from left to right: PTC13, ACHM04-A, ACHM04-H1, heated to 80°C and soaked for 10 minutes. ACHM04-A seems to work better, and does not cause naked wafer damage.
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Heat hardened ink cleaner ACHM04-A to 140°C and soak for 20 minutes. It was found that although the hardened silver ink had been moistened, it could be removed by wiping. But the black glue on the edge package has been damaged, exposing the copper wire.
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Test Hardened Ink Cleaner ACHM01-GG. ACHM01-GG was found to be effective in removing silver hardened inks. However, ACHM01-GG is a gel formulation, which is highly corrosive and is only suitable for wiping. The chip is small in size and not easy to fix and wipe.
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Test Hardened Ink Cleaner ACHM01. It was found that heating the hardened ink cleaner ACHM01 to 140°C and soaking for 1 minute can effectively remove the silver hardened ink.
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Repeat the test. It was found that heating the hardening ink cleaner ACHM01 to 140°C and soaking for 3 minutes can effectively remove the silver hardening ink, and the surface is cleaner.
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Repeat the test, taking the IC wafer whose surface is covered with black ink. It was found that heating the hardened ink cleaner ACHM01 to 140°C and soaking for 3 minutes can also effectively remove the black hardened ink.
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Suggestions and discussions:
9.1 From the results of this experiment, the hardening ink cleaning agent ACHM01 is a more effective cleaning agent. The recommended cleaning conditions are: heat to 140°C, soak for 3 minutes, take it out and rinse with warm water.
9.2 This cleaning test only involves simple heating and soaking. Will the effect be better if it is cleaned with an ultrasonic wave or a cloth brush? It needs to cooperate with the equipment manufacturer for further testing.