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before cleaning
Test the appearance of the workpiece, the front is EMC sealant, and the metal contacts on the back are pasted with PI material tape.
The purpose of this test is to confirm the ability of the agent to remove EMC and whether the tape can withstand the erosion of the agent. Acid and alkali resistant tape is attached to the back of the package with cut corners on the leftmost four sides of the picture below. In the picture below, the two packages on the far left without cut corners are pasted with ordinary adhesive tape on the back.
front
back
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After soaking the ACHM04-Aplus at 90°C for 60 minutes, it was found that the black EMC overflow glue on the side was soft and rotten.
Use a plastic tube to scrape lightly, and the EMC overflow can be easily scraped off.
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The EMC on the front surface of the packaging chip has been slightly softened due to the intrusion of the chemical agent, and the surface can be scraped off with stainless steel tweezers.
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The general PI tape on the back of the package looks intact and undamaged.
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Increase soaking temperature. Heat hardening ink cleaner ACHM04-Aplus to 120°C. Insert the packaging sheet (the back of the packaging sheet with cut corners is covered with acid and alkali resistant tape), and soak for 1 hour.
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It was found that the EMC on the package had swelled and detached.
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The acid and alkali resistant tape looks unharmed.
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in conclusion:
8.1 ACHM04-Aplus can remove this black EMC sealant.
8.2 ACHM04-Aplus will not harm the two PI tapes.
8.3 ACHM04-Aplus will invade the black EMC sealant, causing the black EMC sealant to soften. High temperature and prolonged immersion may cause EMC to swell and warp the packaging metal sheet. It is recommended to selectively remove EMC through temperature, time control, and PI tape masking.