before cleaning
Before the ACF residue is removed.
The purpose of this test is to heat and soak the agent, without wiping or scraping, to effectively remove the residual ACF anisotropic conductive adhesive.

Heat the agent to about (70°C), put it into the Driver IC, soak ACHM04-Aplus for 10 minutes, and find that most of the ACF residue has been removed.

Increase soaking temperature. Heat the agent to about (100°C), put it into the Driver IC, soak ACHM04-Aplus for 10 minutes, and find that most of the ACF residue has been removed.

in conclusion:

ACHM04-Aplus can remove residual ACF anisotropic conductive adhesive.
It is recommended to soak the entire workpiece in a 60~80°C chemical and clean it with ultrasonic vibration.

before cleaning
Before the ACF residue is removed.
The purpose of this test is to heat and soak the agent, without wiping or scraping, to effectively remove the residual ACF anisotropic conductive adhesive.

Heat the agent to about (70°C), put it into the Driver IC, soak ACHM04-Aplus for 10 minutes, and find that most of the ACF residue has been removed.

Increase soaking temperature. Heat the agent to about (100°C), put it into the Driver IC, soak ACHM04-Aplus for 10 minutes, and find that most of the ACF residue has been removed.

in conclusion:

ACHM04-Aplus can remove residual ACF anisotropic conductive adhesive.
It is recommended to soak the entire workpiece in a 60~80°C chemical and clean it with ultrasonic vibration.

before cleaning
Chip type fuse appearance, front and back.

Soak in ACHM04-A cleaning agent at 110°C for 10 minutes, and after shaking slightly, it is found that the black EPOXY sealant has come off.

Take it out and observe it with a microscope, you can clearly see the internal circuit.

before cleaning
The appearance of the metal wafer, the left side of the photo below is the back side, and the right side is the front side. The white (metallic) part of the front is a metal plate (probably aluminum) with black ink printed on top. The purpose of this test is to remove this black hardened ink, but metal and PCB laminates, green solder resist paint, metal feet, etc., cannot be injured.

Tested with different agents. Soaking ACHM04-H1 was found to have no effect. However, after soaking in ACHM04-A cleaning agent at 130°C for 10 minutes, it was found that the black hardened ink on the front had been slightly detached.

Gently touch the softened black ink with a soft nylon tube, and it can be easily wiped off.

Take it out and rinse it with clean water. It was found that neither the front nor the back of the wafer was damaged. The metal plate was also undamaged.

before cleaning

After soaking in ACHM04A cleaning agent at 200°C for 30 minutes, take it out.

Then use a fine needle to remove the softened and residual black glue.

Results and discussion:

Before cleaning, the appearance of the MicroSD mold can clearly see the residue of hardened ink.

Use ACHM04-A hardening ink cleaning agent, heat to 80~90℃, soak for 60 minutes.

After soaking for 60 minutes, brush lightly with a barbecue brush. It was found that most of the residual hardened ink could be easily brushed off.

But a small amount of hardened ink remains on the corners of the mold.

It can be removed with a hard PE plastic tube.

It can also be removed with a copper brush or a metal brush with a hardness lower than that of the aluminum mold. As long as it is a material that does not cause scratches on the aluminum mold, it is fine.

It can also be sprayed with high-pressure air (7Kg/cm2).

The removed hardened ink can be collected with a filter.

Suggestions and discussions:

Before cleaning, the surface of the workpiece is cleaned.

Use ACHM04-A to harden ink cleaning agent and soak at 80~90℃.

Soak for 2 minutes.

Soak for 5 minutes. After taking it out, wash it with clean water. EPOXY resin has been stripped.

Suggestions and discussions:

before cleaning
The aluminum rods are bonded with AB epoxy glue. The curing time after lamination is more than 72 hours.

Soak in AHLR03, AHLR05, ACHM04A cleaning agents at 120°C for 20 minutes, then take them out.

It is found that the epoxy hardened glue soaked in ACHM04A has the best removal effect.

Soak ACHM04A at room temperature for 24 hours, and found that the epoxy hardened glue can also be peeled off without energy consumption.

After soaking, it can be easily peeled off with a razor blade.

Results and discussion:

Since the two materials are bonded together, only the line of the cross-section can be used for chemical intrusion. If the adhesive depth on either side of the bonding surface is more than 10mm, it is recommended to exchange time for the purpose of peeling off the whole piece.
6.1 The workpiece can be soaked in the medicine first. After about 1 hour, there should be 0.5~3mm glue swelling and soft rot along the edge of the seam where the two materials are bonded together.
6.2 Take out the workpiece, insert an expander (triangular plastic sheet or a row of needles) into this slit, place the expander under the workpiece, and continue to soak in the medicine.
6.3 Using the weight of the workpiece itself, as the internal UV glue gradually decomposes, the expander will gradually penetrate into the interior of the workpiece, and spread the two materials that are bonded together, allowing more agents to enter the interior.
6.4 After about 24 to 72 hours, the joints of the workpieces can be separated.