Workpiece description: The silver-plated metal lead frame is molded with Hitachi cel-w-7005d1 Epoxy resin. After baking and curing, it is found that there is a lot of Epoxy overflow on the lead frame. The purpose of this development project is to remove the overflowing glue on the lead frame, and the limiting conditions are: 80°C, soak for 5 minutes, and water jet spray can effectively remove it.
-
Before washing, look. Lots of Epoxy spills on the lead frame.
-
Take a piece of wire frame, the photo of the wire frame below, the right side of the red dotted line, is the part that has not been tested by chemical cleaning. Soak with ACHM04-F Hardening Ink Remover at 80°C for 5 minutes.
-
After spraying with water mist, it is found that most of the overflowing glue can be effectively removed.
-
Observed under a microscope, it was confirmed that the overflow glue can be effectively removed, but the cup frame formed by Epoxy resin has also been corroded.
Comparison: The picture on the left is before cleaning, and the picture on the right is after soaking for 5 minutes with ACHM04-F Hardened Ink Remover at 80°C. It is found that the shape of the cup frame is relatively vague.
-
Change medicine. Tested with ACHM04-A3 Hardened Ink Remover.
Before washing. In the photo of the lead frame in the figure below, the right side of the red dotted line is the part that has not been tested by chemical cleaning.
-
Soak in ACHM04-A3 Hardening Ink Remover at 80°C for 5 minutes. ACHM04-A3 uses a surfactant to penetrate into the interface between the resin and the lead frame. After swelling and softening the resin, spray it with water mist to separate it.
-
It was found that most of the overflow glue can be removed. But there are still a few traces left.
-
Observed under a microscope, it was found that most of the overflow glue had been removed, and the cup frame made of Epoxy resin was not damaged.
However, there are still some glue overflows that cannot be completely removed.
-
Suggestions and discussions:
10.1 ACHM04-A3 Hardening Ink Remover is a better cleaning agent for EPOXY glue overflow, and it will not damage the cup frame formed by Epoxy resin.
10.2 If soaked in ACHM04-A3 at 80°C for 10 minutes, use a water jet machine to spray the resin sand and scrape off the residual glue, it should have better cleanliness.
Repeat soaking with ACHM04-A3 hardening ink remover at 80 °C for another 5 min.
It was found that the overflow glue that could not be removed the first time had been cleaned up, and the cup frame molded with Epoxy resin was not damaged.
