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Before wafer PI removal:
Upper image: x50 times lower image x800 times
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Heat the hardened ink remover ACHM04-H1 to 130°C and soak in the wafer for 10 minutes.
Then rinse with clean water. It was found that the PI on the surface had begun to swell and peel off.
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Heat the hardened ink remover ACHM04-H1 to 130°C, put it into the wafer and soak for 30 minutes. Then rinse with clean water. It was found that the PI on the surface had been removed.
The internal microstructure can be clearly seen.
Above: x50 times
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Magnify to 800 times with a microscope. It is found that there are cracks inside the microstructure, and the customer needs to judge whether it is caused by the soaking agent.
