3D packaging technology is the development direction of chip packaging, but even if it is tested before packaging, there will still be defects after packaging. If the packaged chip can be separated into single chips, the Die with OK function can be repackaged and used. Reduce scrap and save costs. The picture below shows an 8-layer packaged DRAM, which is pasted together by 8 single-layer Dies. After packaging, one or more layers of Dies were found to be defective. It is necessary to separate them without damage and recycle the good Dies. , because the adhesive layer is very tight, it is difficult for general medicaments to enter the joint surface, resulting in very difficult separation.

Put the wafer into the beaker, then add ACHM04-H1 agent and heat it to 160-170 degrees. At this time, the agent starts to boil. After keeping the temperature for 1 hour, it is found that the gap at the middle bonding position of the wafer has begun to expand slightly

Continue heating for about 4 hours and find that the wafer has begun to separate into multiple pieces. At this time, you can suspend heating to see if it has been completely separated.

Continue to heat for about 5 hours and find that the 8 wafers have been completely separated. At this time, stop heating, wait for the agent to cool to room temperature, then take it out, rinse off the surface agent with pure water, and dry it. If you switch to IPA to rinse, it can reduce the generation of water marks

Conclusion: Using ACHM04-H1 can separate 3D packaged multilayer wafers without damaging the wafers

When the surface of aluminum alloy is oxidized, blackened, and anodized, in order to provide fine processing, heat-resistant, insulating, solvent-resistant, acid- and alkali-resistant hardened ink can be used as a mask. After processing, the hardened ink is removed, that is Various shaded graphics can be formed to increase the richness of the surface of aluminum alloy workpieces. However, hardened inks that are resistant to high heat and acid and alkali are not easy to remove. Inks that are easy to remove are not effective at providing flawless coverage. How to "quickly and manpower-saving" peel off the hardened ink with good fastness without damaging the anodic film on the surface of the aluminum alloy workpiece is the goal pursued by the process engineers. In this case, the hardened ink remover ACHM04-H1 was used to remove the hardened ink.
Aluminum alloy workpiece before ink stripping:

Heat the hardened ink remover ACHM04-H1 to 100°C, put it into the workpiece and soak for 10 minutes. Then rinse with clean water.
It was found that the white hardened masking ink on the surface had begun to swell and peel off.

Take it out and rinse it with clean water. It is found that the white hardened masking ink on the surface has been completely removed, revealing the metallic luster of the aluminum at the bottom. And there is no change in the anodized black anodized film and green dyed graphics.

In conclusion, Hardened Ink Remover ACHM04-H1 is an appropriate agent for stripping hardened inks on aluminum alloy surfaces without harming the anodic treatment.