Workpiece description: The surface of the wafer is covered with a transparent plastic film (the material was not disclosed by the customer). After the transparent plastic film is torn off, there is still a layer of backing adhesive attached to the wafer. Tried to tear off the backing adhesive with tweezers, but the backing adhesive was broken, and a large amount of backing adhesive still adhered to the wafer.
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Before washing, look. After tearing off the wafer from the plastic film, it can be clearly seen that there is still a layer of adhesive attached to the wafer (at the red arrow).
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Try soaking with synthetic glue remover SynGC21, hardened ink cleaner ACHM04-A, hardened ink cleaner ACHM04-H2. Observe which agent can melt or swell and soften the gum.
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After soaking for 3 minutes, take it out and find that the synthetic adhesive remover SynGC21 cannot soften or remove the adhesive.
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After soaking for 3 minutes, take it out and find that the hardening ink cleaner ACHM04-A can effectively swell and soften the gum. The adhesive becomes snot-like and can be easily scraped off.
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After soaking for 3 minutes, take it out, and find that the hardening ink cleaner ACHM04-H2 is more effective in swelling and softening the gum. The adhesive becomes snot-like and can be easily scraped off.
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discuss:
6.1 Hardened ink cleaner ACHM04-A and ACHM04-H2 should be able to effectively remove the adhesive on the wafer. And ACHM04-H2 is better. 6.2 Cleaning suggestions:
6.2.1. Use automatic equipment to process the wafer adhesive, first tear off the wafer from the plastic film,
6.2.2. Put it together with the back glue into the cleaning tank filled with ACHM04-H2 agent, and clean it by ultrasonic wave or spray cleaning.
6.2.3 Then move to the second tank, which is also filled with ACHM04-H2 agent, for rinsing. Avoid the back glue in the cleaning tank of the first tank continuously dissolving, the concentration gradually accumulates, and adheres to the wafer.
6.2.4 Move to the rinse tank and clean it with pure water.