Samples before cleaning. Chips (Good Die) are stacked on top of each other. Because the chips are thin and brittle, they are forced to separate by external force, which may easily cause cracks and damage the chips.

Remove the chip and soak it with 6 kinds of agents, such as AHLR03-D2plus, a special water-based paint stripper for aluminum alloy, at room temperature.

It was found that after soaking at room temperature for 24 hours, the exposed back glue of Die soaked in some medicaments was swollen and dissolved. However, because many Dies are stacked on top of each other, the stacked area is not easy for the medicine to penetrate, and the Dies are still stuck, and the chips cannot be separated actively.

Heat all agents to 110~120°C.

It is found that after heating the agent AHLR03-D2plus to 110~120℃, it takes about 1~2 hours. All sticky dies have been separated automatically.

Due to the expansion of the back glue, the wafer is automatically separated.

The wafers were removed and it was found that each wafer had been separated. The residual glue on the back of the Die can be completely cleaned by rinsing with clean water.