Workpiece description: Before laser/CNC cutting into single pieces, the wafer is fixed with UV adhesive to avoid scattering after cutting. Sometimes due to poor UV curing, there is residual glue on the back of the torn wafer after dicing, which affects the subsequent process. The purpose of this experiment is to find an appropriate agent that can remove the residual glue after simple soaking and cleaning without manual wiping.
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Before washing, look.
Observing the back with a microscope, residual glue can be found.
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Use Xiwei TMAHLR03-GU aluminum alloy water-based paint stripper, clean at room temperature with 40Khz, 50W/L ultrasonic wave for 5 minutes, take it out, and rinse it with clean water. Blow dry with air.
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It was found that the residual glue had been removed.
