Description of cleaning case: The customer hopes to remove the solder paste (Solder PastePF275-92M(S) F=11.5) coated on the surface of the wafer with an ultrasonic cleaning process at room temperature and with an appropriate cleaning agent.
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Before cleaning, apply Solder Paste to the glass surface.
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Put the glass coated with solder paste into the dust cleaning agent PTC17plus, and clean it with 40Khz, 100W/L ultrasonic wave for 30 minutes at room temperature (due to the accumulation of ultrasonic energy, the temperature will gradually rise to about 40°C during the cleaning process). . Take it out and rinse it with water.
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It was found that the Solder Paste on the surface had been removed.
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Compare. The picture on the left is before cleaning, and the picture on the right is after cleaning.
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Repeat the test. Take a wafer and apply Solder Paste to the surface of the wafer. Since the laboratory ultrasonic cleaning tank does not have a special fixture for fixing the wafer, in order to prevent the wafer from rolling arbitrarily during ultrasonic cleaning, one end of the wafer is broken to facilitate fixing during cleaning.
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Put the wafer coated with solder paste into the dust cleaning agent PTC17plus, and clean it with 40Khz, 100W/L ultrasonic wave for 30 minutes at room temperature. Take it out and rinse it with water.
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It was found that the Solder Paste on the surface of the wafer had been removed.
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Suggestions and discussions: