Workpiece description: The IC chip is covered with black hardened ink, and the ink is a wafer. There are exposed gold fingers on the other side of the IC chip, and black solder resist ink on the same side as the gold fingers.
The purpose of this cleaning test is to remove the black hardened ink, but the black solder resist ink on the same side as the gold finger cannot be damaged and discoloration should not be caused as much as possible.
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IC wafer appearance before cleaning. Front and back.
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Soak the SGC01plus at 70°C for 30 minutes, take it out and flush, and find that the black hardened ink has been completely removed.
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Wafer appearance after cleaning.
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Repeat the test. IC on another circuit board, covered with black hardened ink, before de-inking.
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Soak the SGC01plus at 70°C for 30 minutes, take it out and flush it, and find that the black hardened ink has been removed.
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But the green paint on the PCB board has also been hurt.
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discuss:
7.1 From the results of this test, it seems that the silicone cleaning agent SGC01plus applied to this workpiece to remove hardened ink seems to be a better agent. However, the silicone cleaning agent SGC01plus is a strong alkaline agent. In order to reduce the erosion of SGC01plus on the wafer, it is recommended to shorten the soaking time of the agent as much as possible, and to assist in spraying with high-pressure (7Kg/cm2) water.
Based on the results of this test, it is estimated that the best effect should be obtained if the soaking conditions of the medicine are controlled at 70-80°C and soaked for less than 3-10 minutes.